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Which technology is right for you?
SURFACE MOUNT
SURFACE MOUNT
SMT provides excellent space utilization and a very high degree of circuit reliability.
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THROUGH-HOLE PCB
THROUGH-HOLE PCB
Our through-hole PCB assembly procedure can handle both leaded and lead-free (RoHs) applications.
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HYBRID THICK FILM
HYBRID THICK FILM
A Hybrid circuit performs all or part of an electronic function by combining and interconnecting...
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CHIP ON-BOARD
CHIP ON-BOARD
When design parameters cannot be met by traditional assembly techniques, Chip-On-Board (COB)...
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MULTI-CHIP MODULE
MULTI-CHIP MODULE
MCM has the same basic construction as Chip-On-Board but with some significant differences.
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BOX BUILD ASSEMBLY
BOX BUILD ASSEMBLY
Box build assembly consists of all the remaining assembly processes required to integrate...
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CONTACT US
103 Grant Street
Aurora, NE 68818
Phone: 402-694-6111
Toll-Free: 800-260-6287
Fax: 402-694-6180